PCB Assembly

Jump to:

• Stencil Printing
• Solder Paste Deposition Measurement
• SMT Component Placement
• Reflow
• Thru-Hole Insertion
• Selective Solder
• BGA X-Ray
• Cleaning
• Press-Fit
• AOI - Automatic Optical Inspection
• Electrical Test

Surface Mount and Thru-Hole Pcb Assembly

Quality, high technology, and flexibility, that's the name of the game in our PCB surface mount SMT manufacturing cell! We have a fully automatic Surface Mount process as well as complete Through Hole soldering assembly capability.

Our SMT process features outstanding equipment from the leaders in our industry. We feature DEK and MPM stencil printing, Mydata SMT pick and place, BTU reflow, BGA X-Ray, and Mirtec Automatic Optical Inspection. Each piece of equipment has been selected with specialized options that when combined as a complete process, sets us apart from the competition.

We have designed our automated PCB assembly processes to allow for quick changeovers and flexibility as well as mid-high volume runs. We can handle BGA's, CGA, 0201 chips, fine pitch components, as well as through hole, odd-form components and press-fit components and connectors. RoHS Lead-free, or Mil Spec. J-STD-001 soldering is available. Our process is environmentally friendly using aqueous washable and no-clean chemistries. Special PCB Substrate Materials such as FR4, Tetrafunctional, Multifunctional, Polyimide, no problem!

PCB Assembly Capabilities by Process Type

Stencil Printing: Control of the stencil printing process is a critical step to high quality solder joints on each PCB Assembly. Altronics has both fully automatic and semi- automatic printers. We have programmable solder paste inspection for fine pitch and BGA, as well as laser based measurement to insure paste height control. We also have specialized equipment to handle large board printing requirements. Of course RoHS lead-free is also available.

Solder Paste Deposition Measurement: Measurement of solder paste thickness is important to insure that the stencil design is working in harmony with the PCB and the stencil printer setup. We use a laser system to measure solder paste thickness to ten thousandths of an inch on all SMT products.

Smt Component Placement: Mydata equipment is known for flexibility! We have several Mydata pick and place machines. One of our machines features large board format capability, while our high speed chip shooter can reach placement rates of up to 14,000 components per hour. Our SMT pick and place process allows us several options to maximize placement speed and flexibility to run a high mix of jobs.

Reflow: BTU is world renown for their high quality ovens. Our specially configured Pyramax features special 24" process width, controlled cooling, and lead free capability.

Thru-Hole Insertion: We install all types of through hole components using several different methods. We have 2 computer controlled Contact systems CS-400 component locators that allow repeatable process controlled builds from 1 piece to 1000+. Programmable ultraclinch mechanism allows programmable lead trim lengths and angle of each component lead. We also can use traditional progressive build slide-line style methodologies where appropriate for your PCB assembly.

Selective Solder: Our Jade programmable Selective soldering system gives us great flexibility for soldering Thru-hole components. This Robotic, 3-axis soldering system is Nitrogen inerted, and can solder both lead and RoHS Lead-Free. No special fixturing is required, and we can solder in. tight areas near SMT components where wave soldering would not be practical.

BGA X-Ray: Our BGA X-ray inspection machine inspects each Ball Grid Array and leadless chip carrier device.

Cleaning: Our processes are environmentally friendly. We use a combination of aqueous cleanable, and also no-clean chemistries in our process to provide a perfect solution for every application. Our Electrovert Aquastorm aqueous closed-loop cleaner sports an optional Hurricane High Pressure Wash to insure products are squeaky clean and free from flux residues and ionic contamination.

Press-Fit (Connectors): Look no further! Altronics is your PCB Assembly Press Fit Specialist! We are seasoned in all aspects of Press Fit assembly. Our state of the art Press Fit insertion equipment offers computerized insertion force control, and SPC data tracking.

AOI - Automatic Optical Inspection: We are always on a mission to automate whenever possible to increase efficiencies, improve quality, and consistency. AOI allow us to automate much of the visual inspection process that is part of our first piece and 100% inspections.

Electrical Test: Each customer has different requirements for electrical testing and verification of their products. We can offer many different levels of testing from continuity, ICT, flying probe, and full functional test.

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