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IPC J-STD-001 Class 3


The IPC/EIA/JEDEC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the pre-eminent authority for military defense and commercial electronics manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.


Our technicians are regularly scheduled to be certified to insure that they are soldering and assembling to exacting standards.

The following training modules are included in the training that our Technicians receive in order to receive certification to IPC-A-610 Class 1, 2, 3, and J-STD-001 Class 1, 2, 3:


Wires and Terminals
This module provides requirements for wire and terminal applications consisting of lecture, review, and instructor demonstrations. The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types and pass the open book exam.

Pin - Through - Hole Technology
This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through-hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove thru-hole components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the exam.

Surface Mount Technology
This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include chips, SOIC's, PLCC's, SOT's, QFP's, TSOP's, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an examination.

Inspection Methodology
This module provides requirements for inspection methodology and a basic introduction to process control issues for assembly. Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard. An examination is also required.


ANSI approved lead free acceptance criteria. World recognized as the sole industry consensus standard covering soldering materials and processes, includes criteria for lead free manufacturing, materials, methods and verification for producing quality soldered interconnections and assemblies.

Solderability tests for component leads terminations, lugs, terminals and wires. Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user

Solderability for printed boards Industry recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance.

Requirements for Soldering Fluxes. Covers requirements for qualification and classification of rosin, organic, and inorganic fluxes according to activity level and halide content of the fluxes. Includes flux containing materials and low residue fluxes for no clean processes.

Requirements for Soldering Pastes Covers requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste.

Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering assembly applications. Prescribes the nomenclature, requirements and test methods for electronic grade solder alloys, fluxed and non-fluxed bar, ribbon, and powder solder; electronic soldering applications and "special" electronic grade solders. This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process.