BACKPLANES

Backplanes and Motherboards: We are expert in all aspects of backplane and press-fit assembly. Call us if you want personalized care for your difficult program. Whether you call them midplanes, motherboards, activeplanes, backpanels, or backplanes, these special assemblies have their share of technical challenges. Altronics specializes in providing solutions to the toughest interconnection technology challenges.

• PCB Thickness from .093" to .300"+
• High layer counts
• Large form factor boards 24"+
• Heavy thermal heat sinking inner layers
• Press-fit connectors
• Buss Bars
• We design special fixturing and tooling

Our "Big and Tall" process is designed to handle these special requirements. From our large form factor SMT -surface mount line, wave and selective solder equipment to our computerized press fit connector insertion equipment, Altronics is your partner for backplane assembly!

Thick Backplanes: The high layer counts typically found in backplanes equates to greater overall thickness of the PCB. Altronics process is capable of handling these "thermally challenged" boards! Backplane innerlayer feature design optimization is critical to allow for proper wetting when through hole soldering is required. We offer manufacturability design review support from design through new product introduction, and into production. We want to help you optimize the reliability of your backplane assembly!

Large Backplanes
Some backplane designs exceed the typical overall form factors that most SMT equipment is designed for. We have special capability that allows us to process backplane assemblies with form factors up to 34+ inches. We can surface mount, solder, and press-fit large your large backplane.

Press Fit Connectors
The heart of many backplane designs are the thousands of compliant pins that make up it's communication superhighway. Press fit connectors offer reliable gas tight joints that require special tooling, fixturing and experience to insert properly. We can engineer, and provide cost effective press-fit connector installation. Our computer controlled presses offer insertion force control that can detect changes in process parameters such as board thickness, hole size, or connector variation.

Special Materials
Some backplane designs require the use of special materials and surface finishes when standard FR4 or solder coating will not meet the challenge. We have experience processing exotic materials and non standard finishes such as gold, nickel, and OSP.

Altronics - Full Service Backplane Assembly